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UV Laser Marking MachineType IIUV Laser Marking MachineType IIUV Laser Marking MachineType IIUV Laser Marking MachineType IIUV Laser Marking MachineType IIUV Laser Marking MachineType II

UV Laser Marking MachineType II

UV Laser Marking Machine adopts INNGU UV Laser source, the third-order cavity frequency doubling technology, compared with infrared laser, UV lasers at 355nm provide a small-size spot and a big focal depth, short laser wavelength interrupts molecular chains of material, can greatly reduces the mechanical deformation and temperature distortion of materials, it is a cold laser, mainly used for super precise marking and engraving, particularly suitable for food, pharmaceutical packaging material marking, micro porous, high-speed dividing for glass, complex graphics wafer cutting on silicon materials, etc.
Contact information

0086-150-1350-9330

  • Technical Parameters

                         


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Main Configurations
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Feature

1. High-quality laser beam, small-size spot, can do super precise marking & engraving.

2. Perfect marking performance:

    (1) Short UV wavelength 355nm reduces heat effect on work piece;

    (2) Precise marking effect and available repeatable marking;

    (3) High precision scanning galvanometer laser head;

    (4) Extraordinary fine spot guarantees perfect marking performance;

    (5) Non-contact marking.Permanent mark.

3. Heat affected area is very small, no heating effect, material will not be burned or deformed.

4. High marking speed, high efficiency, stable performance, small size, low power consumption.

5. Very suitable for the material which is greatly reacted by thermal radiation, can work with production line to
    feed and discharge materials automatically.


Application

1. UV Laser Marking Machine is mainly used in precision processing of high-end market, handicrafts, medicine,
    cosmetics, video and other polymer materials packaging bottle, the mark is very precise and stands wear, better
    than ink printing and pollution-free.

2. The flexible PCB marking and scribing, silicon and wafer micro hole, blind hole processing;

3. LCD glass QR code marking, glass wares punching, metal surface coating marking, plastic buttons, communications
    equipment, gifts and so on.

5. Very suitable for the material which is greatly reacted by thermal radiation, can work with production line to feed and
    discharge materials automatically.

 
Technical Parameters

ModelMY-UV03
Laser Power3W
Optional Laser Power5W / 7W / 10W
Laser Wavelength355nm
Working Area100*100mm
Optional Working Area70*70mm /140*140mm / 175*175mm / 200*200mm / 300*300mm
Beam QualityM2 <1.2
Output Laser Power0~100% adjustable
Output Frequency5KHz~80KHz adjustable
Power Stability (8h)<±1%rms
Pulse Width10-50ns
Focus Spot Diameter<0.01mm
UV Laser SourceINNGU Laser
Scan HeadGalvoTech
Controller and SoftwareBJJCZ controller and EZCAD software
Marking Speed7000mm/s
Min. Line Width≤0.005mm
Min. Character0.15mm
Repeated Precision±0.003mm
Compatible Format of FilePLT, DXF, AI, BMP, JPG and so on.
System Operation EnvironmentWindows XP / 7 / 8 / 10 - 32 / 64bits
Cooling ModeWater Cooling
Operation Environment15℃~35℃
Lifespan of UV Laser SourceMax. 20,000 hours


Optional Devices
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Shipment

Within 5~7 working days after receiving your payment.


Packaging

International Standard Packing--Plywooden Case--free of fumigation.


Warranty

Whole machine has a warranty period of 12 months since the production date.

Training

1~3 working-days training free of charge in factory. The buyer can discuss the details with WISELY salesman.

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No. 7 Building, No. 5 Industry Zone Citianpu, Gongming, Guangming New District, Shenzhen 518106 China                                                                   

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